Sydney Ryan and team awarded top placements in national packaging design challenge

2017 Oct 6

Four of eight student design teams from Rochester Institute of Technology that were entered in the national Paperboard Packaging Alliance competition were awarded top placements for excellence in design. The teams were part of the alliance's annual student design challenge and recognized recently at Pack Expo International, one of the largest trade shows for the packaging industry held in Las Vegas, Sept. 25-27. More than 60 entries from 13 collegiate teams were in the competition.

Student teams were asked to design an interactive package for a fitness tracker that allows customers to try the product on before purchase and re-use it afterward to store the device.

Sydney Ryan and team received a shout out, or special acknowledgements, for SHIFT.

Congrats, Sydney!